Stacked-die half-bridge boosts MOSFET power density

AOS’s 80V power conversion MOSFET features DFN6x5 AmpStack packaging

Breakthrough Packaging Enhances Power Density in AOS’s Latest MOSFETs

IBM pursues sequential transistor stacking for next-generation chip design, diverging from rivals

IBM has presented research at the IEEE VLSI Symposium detailing a different approach to next-generation transistor design. While all major c

IBM's 0.7nm Node and NanoStack: A Technical Deep Dive into Next-Generation Semiconductor Technology

IBM announces a 0.7nm process node featuring a new transistor architecture called "NanoStack." The article is a deep-dive technical analysis

IBM Unveils 0.7nm Chip Prototype With 100 Billion Transistors Using Novel 3D Nanostack Architecture

IBM has announced the world's first sub-1 nanometer chip technology at the 0.7 nm node, featuring a novel 3D transistor architecture called

University of Illinois researchers develop 3D chip stacking technique to extend Moore's Law

Researchers at the University of Illinois Grainger College of Engineering have developed a breakthrough in 3D chip manufacturing that could