Breakthrough Packaging Enhances Power Density in AOS’s Latest MOSFETs

Applied Materials VP discusses AI, energy demands, and semiconductor innovation beyond traditional scaling

In this interview, Sundeep Bajikar, VP of Corporate Strategy and Marketing at Applied Materials, discusses how the semiconductor industry is

Scientists just measured the smallest possible contacts for future computer chips

Nexperia’s 1200 V SiC MOSFETs in QDPAK packaging

IBM's 3D chip prototype packs 100 billion transistors, doubling current density

IBM has announced a prototype chip that packs nearly 100 billion transistors onto a fingernail-sized 10mm x 15mm chip, nearly doubling the t

IBM's 3D chip prototype packs 100 billion transistors, doubling current density

IBM has announced a prototype chip that packs nearly 100 billion transistors onto a fingernail-sized 10mm x 15mm chip, nearly doubling the t

IBM's 0.7nm Node and NanoStack: A Technical Deep Dive into Next-Generation Semiconductor Technology

IBM announces a 0.7nm process node featuring a new transistor architecture called "NanoStack." The article is a deep-dive technical analysis

University of Illinois researchers develop 3D chip stacking technique to extend Moore's Law

Researchers at the University of Illinois Grainger College of Engineering have developed a breakthrough in 3D chip manufacturing that could