SEMI maps advanced packaging capacity growth
Backend semiconductor capacity is moving into the design conversation fast. SEMI and TechSearch International have expanded their assembly and test database to cover more than 820 global facilities…
Read the full articleYou might also wanna read
SEMI and TechSearch International map advanced packaging growth
SEMI and TechSearch International have released the 2026 edition of the Worldwide Assembly & Test Facility Database, expanding its coverage
Semiconductors: Etching the new map of strategic supply
As geopolitics shift, more countries are wooing semiconductor manufacturers to enhance resilience. At the same time, demand for advanced sem
Google in Talks With Samsung to Manufacture Future AI Chip Component Amid TSMC Capacity Crunch
Google is considering giving Samsung Electronics a crucial role in making a component of one of its most advanced future AI chips, as the on
TSMC CEO says chipmaker is struggling to meet AI-driven demand despite US factory expansion
The world’s biggest chipmaker says it could take a ‘very long time’ to fulfill customers’ needs with US-based production.
Applied Materials VP discusses AI, energy demands, and semiconductor innovation beyond traditional scaling
In this interview, Sundeep Bajikar, Vice President of Corporate Strategy and Marketing at Applied Materials, discusses the evolving role of

Samsung gains chipmaking orders from BYD, Google, AMD as AI demand strains TSMC capacity
Demand for AI infrastructure strains advanced capacity of market leader TSMC

Comments
Sign in to join the conversation.
No comments yet. Be the first.