SEMI and TechSearch International map advanced packaging growth
1h ago
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SEMI and TechSearch International have released the 2026 edition of the Worldwide Assembly & Test Facility Database, expanding its coverage to more than 820 semiconductor back-end manufacturing facilities worldwide. The latest version also introduces new data fields that provide deeper visibility into advanced packaging, compound semiconductors, AI infrastructure and photonics. For eeNews Europe readers, the […] The post SEMI and TechSearch International map advanced packaging growth appeared first on eeNews Europe .
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