Huawei will 1, 4-Nanometer ohne EUV: Logicfolding ab 2031
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SHENZHEN / LONDON (IT BOLTWISE) – Huawei will die EUV-abhängige Fertigungsschiene bei hochmodernen Chips verlassen und plant ab 1, 4 Nanometern eine neue Logicfolding-Architektur. Erste mobile Kirin-Prozessoren sollen bereits im Herbst 2026 mit dieser Logik starten, bis 2031 folgen dann Chips im 1, 4‑Nanometer-Bereich. Der Ansatz zielt darauf, mehr Transistorleistung und schnellere Datenpfade ohne den […] ... den vollständigen Artikel »Huawei will 1, 4-Nanometer ohne EUV: Logicfolding ab 2031« lesen Dieser Beitrag Huawei will 1, 4-Nanometer ohne EUV: Logicfolding ab 2031 erschien als erstes auf IT BOLTWISE x Artificial Intelligence .
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