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Near-memory Dequantization Architecture In Custom HBM for LLM inference (SK hynix)
Researchers from SK hynix published a technical paper titled “StreamDQ: Near-Memory Weight DeQuantization in Custom HBM for Scalable AI Inference Acceleration.” The paper proposes StreamDQ for “a lightweight architectural enhancement that enables on-the-fly dequantization in the memory subsystem for high-throughput, large-batch LLM inference,” and reports “u
AI Framework Maps Thermal Behavior In 3D Photonic Circuits (U. of Florida et al.)
Researchers from University of Florida, ficonTEC Service, and Colorado State University published a technical paper titled “AI-Driven Thermal Mapping and Management in 3D Integrated Photonic Circuits.” Abstract Excerpt: “Photonic Integrated Circuits (PICs) are advancing high-performance computing, data centers, and sensing, yet three-dimensional (3D) PICs in
Room-temperature, CMOS-compatible Photonic Quantum Processor (NUS et al.)
Researchers from Rotonium, Centre for Quantum Technologies at National University of Singapore, Inveriant, Politecnico di Milano, and CNIT published a technical paper titled “Design and Benchmarking of a Quantum Photonic Chip.” Abstract Excerpt: The paper presents a quantum photonic processor based on “standard CMOS-compatible manufacturing processes” and op
Monolithic CMOS Platform Integrates Piezo-Optomechanical Photonics (Mitre et al.)
Researchers from MITRE, University of Colorado Boulder, Sandia National Laboratories, University of Arizona, and MIT published a technical paper titled “Monolithic Integration of Piezo-Optomechanical Photonics and CMOS Electronics.” Abstract Excerpt: The paper demonstrates a “fully monolithic, all-CMOS fabricated platform” for piezo-optomechanical photonic i
3nm GAA-FET SRAM Review Evaluates Self-Heating And Radiation Hardness (SJSU, Sandia)
Researchers from San Jose State University and Sandia National Laboratories published a technical paper titled “Self-Heating and Radiation Hardness Studies of 3nm GAA-FET-Based SRAM with Different Substrate Isolation Techniques.” Abstract Excerpt: “In addition to the traditional bottom dielectric isolation (BDI), which isolates the source/drain (S/D) from th
Hardware Abstraction Layer Study Targets Software-Defined Vehicles (U. of Stuttgart)
Researchers from University of Stuttgart published a technical paper titled “Evaluating Hardware Abstraction Layer Concepts for Software Defined Vehicles: Insights into Applicability and Effectiveness.” Abstract Excerpt: “The emergence of Software-Defined Vehicles represents a fundamental shift in automotive design, prioritizing software-centric architecture
Open DRAM Model For PIM Analysis In 3D DRAM (Georgia Tech)
Researchers from Georgia Institute of Technology published a technical paper titled “Open DRAM Model—Part II: Enabling Processing-in-Memory in 3-D DRAM.” Abstract Excerpt: “In this work, we present an “Open DRAM Model” that enables comprehensive circuit-level analysis of DRAM operations across multiple architectures, including conventional 6F2 BCAT, scaled 4