Appears on
Articles15
Why Real-Time LLM Performance Still Hits a Wall Despite Faster GPUs
Benchmark gains often mask a deeper challenge: memory-bound token generation remains LLM inference's limiting factor. The post Why Real-Time LLM Performance Still Hits a Wall Despite Faster GPUs appeared first on EE Times Asia .

Using Boost Controller to Generate Regulated Negative Output from Negative Input
Analog Devices Completes Acquisition of Empower Semiconductor
ADI has further strengthened its position as a leading strategic, system-level grid-to-core power partner across the entire AI ecosystem. The post Analog Devices Completes Acquisition of Empower Semiconductor appeared first on EE Times Asia .
Samsung Commences Mass Production of PCIe 6.0-based eSSD
Samsung's latest eSSD features 9th-generation V-NAND, 4nm controller and liquid-cooling optimization to support demanding AI workloads. The post Samsung Commences Mass Production of PCIe 6.0-based eSSD appeared first on EE Times Asia .
Breakthrough Packaging Enhances Power Density in AOS’s Latest MOSFETs
AOS's breakthrough packaging technology enables high-density designs for various power conversion applications. The post Breakthrough Packaging Enhances Power Density in AOS’s Latest MOSFETs appeared first on EE Times Asia .

TrendForce Forecasts Global Notebook Shipments to Decline 14% in 2026

Infineon Opens World’s Largest Smart Power Semiconductor Fab in Dresden
SiTime Completes Acquisition of Renesas’ Timing Business
SiTime has acquired from Renesas the preeminent brand in clocking with a 30-year legacy of highly differentiated clocking products. The post SiTime Completes Acquisition of Renesas’ Timing Business appeared first on EE Times Asia .
Kioxia and Sandisk Start Production of 10th-gen 3D Flash Memory Devices
The companies showcase ongoing buildout of manufacturing infrastructure at K2 to address growing demand for NAND flash. The post Kioxia and Sandisk Start Production of 10th-gen 3D Flash Memory Devices appeared first on EE Times Asia .
AI Component Capacity Squeeze, Foundry Output Cuts to Extend Mature-node Price Increases in 2027
The growing demand for AI-related products has significantly altered the supply-and-demand balance for mature process nodes. The post AI Component Capacity Squeeze, Foundry Output Cuts to Extend Mature-node Price Increases in 2027 appeared first on EE Times Asia .
AI Inference Pushes Memory Beyond DRAM and HBM
Growing AI inference workloads are exposing memory capacity limitations, driving interest in high-bandwidth flash as a scalable alternative. The post AI Inference Pushes Memory Beyond DRAM and HBM appeared first on EE Times Asia .

Global Foundry 2.0 Revenue Jumps 23% YoY in 1Q 2026
GigaDevice Expands Non-volatile Memory Portfolio
GigaDevice Semiconductor has expanded its non-volatile memory portfolio with the launch of its new GD24CL series I²C EEPROM. The post GigaDevice Expands Non-volatile Memory Portfolio appeared first on EE Times Asia .
Alif Semiconductor Adds Sirin Software to Partner Ecosystem
Sirin Software has officially joined the Alif Semiconductor partner ecosystem as an authorized design house. The post Alif Semiconductor Adds Sirin Software to Partner Ecosystem appeared first on EE Times Asia .
ChipApex Strengthens Component Sourcing Services to Address Chip Supply Challenges
ChipApex expands its procurement services to help manufacturers by accelerating access to critical semiconductor components. The post ChipApex Strengthens Component Sourcing Services to Address Chip Supply Challenges appeared first on EE Times Asia .

