芯片厂商Tower Semiconductor将在日本投资30亿美元
PANews 7月15日消息，据路透社报道，芯片制造商 Tower Semiconductor 当地时间 7 月 14 日宣布，将投资 30 亿美元加强在日本的芯片制造，其中包括来自日本政府的 10 亿美元拨款。声明称，第一阶段将大幅增加 300 毫米硅光子器件产能，预计将于 2027 年第四季度全面投产。该阶段包括改造原 Fab 6 工厂，使其具备 300…
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