Engineering at the Limits of Speed and Scale: The State of Hardware Design
DesignCon 2026 brought together engineers and experts in electrical engineering and semiconductor design. Here are some highlights from the event!
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Bridging the Semiconductor Talent Gap: Cross-Training CS Students and AI-Assisted Hardware Design
To fill the talent gap, CS majors could be taught to design hardware, and the EE curriculum could be adapted or even shortened.
See Autonomous Chip Design in Action with ChipAgents at DAC 2026
For decades, semiconductor innovation has been constrained not by imagination, but by engineering capacity. While transistor density has con
See Autonomous Chip Design in Action with ChipAgents at DAC 2026
For decades, semiconductor innovation has been constrained not by imagination, but by engineering capacity. While transistor density has con

EMIB-T Roadmap, Custom HBM, HBM4 Packaging Challenges, Microfluidic Cooling, Photonic Interconnects, and More
ECTC 2026 Roundup, Intel, TSMC, SK Hynix, Samsung, Micron, Marvell, Lightmatter, Microsoft
Proceedings of the Great Lakes Symposium on VLSI 2026
GLSVLSI '26: Proceedings of the Great Lakes Symposium on VLSI 2026.

SPICE Simulation Tool Celebrates 40 Years as Semiconductor Industry Standard
SPICE, the Simulation Program with Integrated Circuits Emphasis, has turned 40 years old. The IEEE has marked the occasion by designating th

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