Cadence rolls out AI agent to speed circuit board, chip packaging design
By Stephen Nellis SAN FRANCISCO, July 15 (Reuters) - Cadence Design Systems on Wednesday launched an artificial-intelligence "super agent" that design...
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Cadence rolls out AI agent to speed circuit board, chip packaging design
By Stephen Nellis SAN FRANCISCO, July 15 (Reuters) - Cadence Design Systems on Wednesday launched an artificial-intelligence "super agent" t
Cadence's 'Super Agents' Aim to Revolutionize Chip Design with AI Power
Cadence accelerates innovation in chip design with its 'Super Agents,' integrating AuraStack for enhanced AI-driven solutions. This could re
Cadence Launches AuraStack AI Super Agent for PCB and Packaging Design
SAN JOSE, Calif., July 16, 2026 — Cadence has introduced the AuraStack AI Super Agent on Cadence Allegro AI Studio, the world’s first agenti
Cadence introduces AuraStack AI Super Agent
The platform coordinates AI agents across planning, implementation and multiphysics analysis for PCB and packaging design. The post Cadence
Cadence Unleashes AI Agent AuraStack: Beyond Silicon
Cadence Design Systems launches AuraStack, an AI agent revolutionizing post-silicon packaging and system design. This marks a significant sh
Cadence AuraStack debuts to boost PCB and packaging designers
New AI Super Agent from Cadence gets nods from Nvidia, TSMC, Schneider
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