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Leaked A20 Pro chip layout suggests iPhone 18 Pro series to get wider memory interface and improved thermals

By

Anil Ganti

6d ago· 2 min readenNews
technologynews

Summary

A leaked package layout of Apple's upcoming A20 Pro chip, expected to power the iPhone 18 Pro and iPhone 18 Pro Max, reveals several upgrades. The SoC reportedly features a wider 96-bit memory interface (up from 64 bits), potentially boosting memory bandwidth by up to 50%. Additional improvements include a redesigned packaging approach for better thermal management and a larger Neural Processing Unit (NPU).

Source

bskyLeaked A20 Pro chip layout suggests iPhone 18 Pro series to get wider memory interface and improved thermalsnotebookcheck.net

Key quotes

· 3 pulled
A package layout leak reveals the next-gen SoC in detail and hints at notable upgrades.
Its memory interface is reportedly 96 bits wide, up from 64 bits on previous generations, potentially increasing memory bandwidth by up to 50% before accounting for any gains from faster memory.
The next-gen SoC is said to feature a wider 96-bit memory interface, a redesigned packaging approach for improved thermals, and a larger Neural Processing Unit (NPU).
Snippet from the RSS feed
A leaked package layout of Apple's A20 Pro hints at several notable upgrades for the iPhone 18 Pro series. The next-gen SoC is said to feature a wider 96-bit memory interface, a redesigned packaging approach for improved thermals, and a larger Neural Proc

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