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Calibre IC Manufacturing in 2025: The year’s biggest news
Read about 2025 highlights from Siemens Calibre IC Manufacturing group, including advances in computational metrology, monotonic machine learning, AI, EUV and GPU acceleration
Siemens acquires Canopus AI: Supercharging semiconductor manufacturing with AI-powered metrology
Siemens acquires Canopus AI to advance semiconductor manufacturing with AI-powered metrology and inspection, boosting precision, efficiency, and yield.
How to use Calibre parasitic extraction tools: a step-by-step guide
A step by step guide designed to help users master the Calibre parasitic extraction tools
The engineering talent pipeline: How Siemens is helping to build tomorrow’s workforce
Siemens EDA recognizes that the future of manufacturing depends on a robust pipeline of skilled talent. That’s why we have partnered with ChipsHub to be part of a comprehensive workforce development ecosystem
ICYMI: Siemens EDA at 2026 SPIE Advanced Lithography + Patterning
Read about Calibre Manufacturing’s highlights from the 2025 SPIE Advanced Lithography Patterning symposium.
From data to domain expertise: How AI, accelerated computing and digital twins are reshaping semiconductor manufacturing
Explore the dawn of industrial AI in semiconductor manufacturing. Learn how Siemens EDA is leveraging AI, digital twins, and GPU-accelerated computing to empower engineers, automate workflows, and build smarter factories.
Meeting the challenges of reliability verification for the era of 3D ICs
Advanced reliability verification for 2.5D/3D ICs with Innovator3D IC and Calibre 3DPERC. Ensure robust reliability and accelerate sign-off.
Why a GPU rasterizer matters for computational lithography in both performance and precision at scale
This technical analysis explores GPU rasterizer for accelerated mask synthesis. Benchmarks show 290x speedup for Manhattan geometries and 45x for curvilinear shapes with
Tackling compute complexity in ESD verification with Calibre
Explore how Calibre PERC and Calibre 3DPERC tackle the escalating compute complexity of ESD verification in advanced IC designs, including 2.5D and 3DIC structures, ensuring robust protection and signoff-quality results
The Calibre 3D IC solution: Mastering the complexities of advanced 3D IC chip design
Optimize 3D IC chip design from concept to sign-off with Calibre 3D IC solutions. Achieve accurate electro-thermo-mechanical co-simulation, prevent costly errors, and accelerate time-to-market.