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Brendan Burke

12 articles found across 1 feed

Appears on

Articles12

Will the First Wave of Synopsys Multiphysics Fusion Start the Next Wave of AI Chip Designs?

Synopsys Multiphysics Fusion solutions embed Ansys signoff analysis into design workflows, accelerating AI chip design with up to 10x faster closure.

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Techstrong Semi15d ago

Can AMD and Rackspace Scale Sovereign AI Inference?

AMD and Rackspace’s partnership deploys 30 MW AI compute capacity for regulated enterprise environments starting late 2026.

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Techstrong Semi15d ago

Will a U.S. Quantum Foundry Leverage $4.6 Billion in New Capital to Become the Next TSMC?

With $4.6B in new capital, is a U.S. Quantum Foundry set to become the next TSMC? Learn how recent investments are reshaping quantum manufacturing.

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Techstrong Semi14d ago

AWS Summit NY 2026: Is AI Infrastructure AWS’s Real Agentic Moat?

At AWS Summit New York 2026, AWS AI infrastructure — G7 Blackwell GPUs, QuEra quantum, AMD Outposts, and RGN networking — anchors its agentic push.

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Techstrong Semi13d ago

Jalapeño in Nine Months: Did AI Just Break Chip Design Timelines?

OpenAI and Broadcom shattered chip design timelines with Jalapeño, completing a nine-month tape-out using AI acceleration.

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Techstrong Semi9d ago

Will Intel 18A-P Risk Production Bring External Foundry Customers Through the Door?

Intel 18A-P enters risk production with 9% performance boost and new Power Boost transistor, positioning Intel Foundry to attract external customers.

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Techstrong Semi9d ago

Look Past IBM’s 0.7nm Label: Nanostack Architecture Is the Real Breakthrough

IBM’s nanostack architecture represents the real breakthrough in chip technology, delivering 50% more performance and 70% greater energy efficiency.

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Techstrong Semi9d ago

Qualcomm’s Investor Day 2026: Agentic and AI Inference To Drive 2x Revenue Growth by 2030

Qualcomm’s strategy to combine its expanding agentic edge ecosystem with its data center inference opportunity could double its revenue by 2030.

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Techstrong Semi8d ago

Applied Materials’ Master Class Schools Memory Makers on Logic-Class Fabrication

Advanced packaging systems from Applied Materials enable AI-scale logic-memory convergence with laser process control.

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Techstrong Semi7d ago

NVIDIA Jetson in Lunar Orbit Signals Commercial GPUs Are Ready for Spaceflight

Commercial GPUs are ready for spaceflight as NVIDIA Jetson readies for lunar orbit on Firefly’s Blue Ghost Mission 2.

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Techstrong Semi6d ago

Infineon’s €5 Billion Dresden Fab Reshapes the Global Power Semiconductor Supply Chain

Infineon’s Dresden Fab reshapes global power semiconductor supply chain with €5 billion investment.

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Techstrong Semi1d ago

NVIDIA DSX Promises More Revenue per Gigawatt. Who Actually Captures It?

NVIDIA DSX promises more revenue per gigawatt through efficiency gains with a new revenue sharing model that expands NVIDIA’s role in the AI buildout.

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Techstrong Semi1d ago
Brendan Burke: Articles | FeedBagel