Google Presents Liquid Cooling Solutions for AI Datacenters at Hot Chips 2025
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Summary
Google presented on liquid cooling technology for datacenters at Hot Chips 2025, highlighting how water's superior thermal conductivity (4000x better than air) makes it essential for cooling high-power AI and machine learning chips. The article discusses the growing adoption of liquid cooling in datacenters due to increasing power demands and heat output from modern processors.
Key quotes
· 3 pulledWater has a thermal conductivity about 4000 times that of air, making it an attractive solution to deal with the cooling demands associated with the current AI boom.
Liquid cooling has taken an increasing role in datacenters, amid increasing power draw and correspondingly high heat output from the latest chips.
Machine learning in particular has an insatiable appetite for power and cooling.
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