Texas Institute for Electronics Transforms 1980s Fab into World's Only 3D Heterogeneous Integration Facility for DARPA Program
By
rbanffy
6mo ago· 5 min readenNews
97/100
Golden Brown
Bagelometer↗
If you only eat one bagel today, this is the bagel.
Score97TypenewsSentimentpositive
Summary
The Texas Institute for Electronics (TIE) in Austin, Texas, is transforming a 1980s-era semiconductor fab into the world's only advanced packaging plant dedicated to 3D heterogeneous integration (3DHI). This facility supports DARPA's Next-Generation Microelectronics Manufacturing (NGMM) program, which aims to revolutionize microelectronics through 3DHI—stacking chips made of multiple materials including both silicon and non-silicon components. The initiative represents a significant advancement in semiconductor manufacturing and packaging technology.
Key quotes
· 4 pulledThe Texas Institute for Electronics (TIE), as it's called now, is tooling up to become the only advanced packaging plant in the world that is dedicated to 3D heterogeneous integration (3DHI)—the stacking of chips made of multiple materials, both silicon and non-silicon.
"NGMM is focused on a revolution in microelectronics through 3D heterogeneous integration," said Michael Holmes, managing director of the program.
The fab is the infrastructure behind DARPA's Next-Generation Microelectronics Manufacturing (NGMM) program.
A 1980s-era semiconductor fab in Austin, Texas, is getting a makeover.
Can a 1980s-era fab in Austin transform the future of microelectronics with 3D heterogeneous integration?
