Samsung begins shipping new HBM4E memory chip samples to AI clients
By
Albert Cuesta
Sketches a bagel but doesn't bake it through.
Summary
Samsung Electronics has begun distributing samples of its new high-bandwidth memory (HBM) units to select clients. The company claims to be the first in the industry to offer the 12-layer HBM4E unit, which is designed to maximize computing performance for large language models (LLMs) and next-generation AI systems. This follows the mass production and commercial shipment of their HBM4 earlier this year.
Key quotes
· 3 pulledSamsung Electronics ha empezado a distribuir muestras de sus nuevas unidades de memoria de alto ancho de banda (HBM) entre clientes seleccionados.
La empresa ha señalado que el chip contribuye a maximizar el rendimiento de computación para grandes modelos de lenguaje (LLM) y sistemas de IA de nueva generación.
Samsung presume de ser la primera firma del sector en ofrecer la unidad HBM4E de 12 capas, y ha precisado que el lanzamiento ha llegado tras la producción en masa y el envío comercial de su HBM4 a principios de este año.
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