Apple A19 chip die shot analysis reveals TSMC N3P process, improved GPU and efficiency
By
giuliomagnifico
8mo ago· 1 min readenInsight
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Summary
This article presents the first high-resolution die shot analysis of Apple's A19 chip, extracted from the iPhone 17. Built on TSMC's third-generation 3 nm process node (N3P), the A19 is a refinement over the N3E technology used in the A18 series. Key improvements include higher transistor density, better energy efficiency, and modest performance gains. The CPU retains a hybrid core design with performance and efficiency cores, while the GPU features additional cores.
Key quotes
· 3 pulledThese images represent the first high-resolution microscopy of Apple's A19 chip, extracted from the iPhone 17, revealing its full complexity under the hood.
Built on TSMC's third-generation 3 nm process node—dubbed N3P—the A19 marks a refinement over the earlier N3E technology used in the A18 series, offering higher transistor density, better energy efficiency, and modest performance gains.
On the CPU side, the chip retains a hybrid core design (performance plus efficiency cores), while upgrades to the GPU include more core
Die shot analysis of Apple's A19 SoC located in the iPhone 17
