AMD Developing First ARM-Based APU "Sound Wave" on TSMC 3nm Process
By
walterbell
Toasted just enough. A reliable bake, gently seasoned.
Summary
AMD is developing its first ARM-based APU called "Sound Wave," expanding beyond its traditional x86 architecture. The chip was discovered through customs import records and features a BGA-1074 package measuring 32mm × 27mm, making it suitable for thin and light mobile computing platforms. The processor uses a 0.8mm pitch and FF5 interface, indicating it's built on TSMC's 3nm process technology.
Key quotes
· 4 pulledAMD is expanding its processor portfolio beyond the x86 architecture with its first ARM-based APU, internally known as 'Sound Wave.'
The chip's existence was uncovered through customs import records, confirming several details about its design and purpose.
Built with a BGA-1074 package measuring 32 mm × 27 mm, the processor fits within standard mobile SoC dimensions, making it suitable for thin and light computing platforms.
It employs a 0.8 mm pitch and FF5 interface, indicating advanced manufacturing technology.
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